OBJECTIVES
The Webinar aims to provide participants with a concise yet
comprehensive understanding of SiC, GaN, and emerging WBG
technologies. It covers fundamental device concepts, the design and
manufacturing lifecycle, digital-twin-based modelling for GaN packaging,
and key thermal considerations. The program also highlights India’s
current WBG ecosystem and the opportunities ahead. Overall, the
webinar strengthens participants foundational and industry-relevant
knowledge in next-generation semiconductor devices

Who should attend:

Industry professionals in power electronics, semiconductors,
EVs, and energy systems

R&D engineers working on SiC/GaN devices or packaging

Startup teams exploring WBG technologies

Anyone interested in WBG and emerging UWBG devices